Last Update   December  2018



Takatori Tape and De-Tape Systems

Front side wafer protection, pre-wafer grinding applications.

Atmospheric and Vacuum options available.

Thin wafer handling specialists.

Wafer Sorting Systems

For Thickness / Warp / Bow

/ Resistivity / OCR / SFQR etc




Tom Murray


Tel 07939 285783

Takatori Wire Saws

Single or Multi Wire

Diamond Wire or Slurry Saws

For SiC, Sapphire, GaN, GaAs and

many more hard materials.

Wafer Polishing Systems